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Dr.
Howard Johnson's
Signal
Integrity Laboratory

SiLab Volume I
Lab Demos from the course
High-Speed Digital Design: A Handbook of
Black Magic
1.1 Path of RF Current
At
radio frequencies, current no longer follows
the path of least resistance. Instead, it
follows the path of least inductance.
(Practical demonstration)
1.2 Inductance of Bypass Capacitor
The
pads and vias associated with a
surface-mounted bypass capacitor exert
tremendous influence over its high-frequency
performance. This laboratory session
presents a simple intuitive model of the
electrical behavior of pad and via
structures, illustrating in a direct way the
importance of good layout. (Measured
data)
1.3 Metastability
What happens when you violate the setup or
hold time of a flip-flip? Sometimes the
output goes to one, sometimes it goes to
zero, and sometimes - this is the subject of
metastability - it takes a long time to make
up its mind. (Live lab demonstration)
SiLab
Volume II
Lab Demos from the course
High-Speed Signal Propagation: Advanced
Black Magic
2.1 Via Inductance
A
general theory of pcb via inductance,
confirmed by direct measurements taken on a
giant scale model, reveals the importance of
having good interplane connections near
those spots where high-speed signals
traverse vertically through your layer
stack. (Measured data)
2.2 Serial Link Architecture
See
typical signals inside a working
multi-gigabit serial link. Hear about
practical tradeoffs associated with
differential trace geometry, connector
crosstalk, and pcb vias. (Live
demonstration: RocketIO at 10 Gb/s)
Features and specifications shown may differ
from those presently available.
2.3 Serial Link Budgeting
A
link attenuation budget focuses your
attention on the parts of your system that
cause the greatest signal degradation, like
backplane connectors, pcb trace losses and
DC blocking capacitors. (Worked example:
RocketIO at 6.25 Gb/s)
Features and specifications shown may differ
from those presently available.
SiLab
Volume III
Lab Demos from the course
High-Speed Noise and Grounding: More Black
Magic
3.1 Mixed-Signal Isolation
Watch Dr. Johnson prove his rules for signal
isolation at audio frequencies with concrete
laboratory demonstrations. At radio
frequencies everything gets harder, but he
still manages to achieve isolation better
than one part in a million (120 dB).
(Measured data)
3.2 BGA Ground Ball Placement
Dr.
Johnson modifies, in real time, the pattern
of power and ground pins within a large BGA
package while observing the difference in
crosstalk obtained with various patterns.
(Measured data)
3.3 RoHS (Joe Fjelstad)
Have doubts about lead-free solder? Joe
Fjelstad, an expert in interconnection
technology, drops a bomb on the whole
process, explaining why the RoHS lead-free
solder initiative is not better for
the environment, it is actually worse.
His argument, which comes straight from the
U.S. EPA, undercuts the whole basis of RoHS
legislation.

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